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dc.contributor | Universitat Politècnica de Catalunya. Departament d'Enginyeria Electrònica |
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dc.contributor | Universitat Politècnica de Catalunya. HIPICS - Grup de Circuits i Sistemes Integrats d'Altes Prestacions |
dc.contributor.author | Jordà, Xavier |
dc.contributor.author | Perpiñà, Xavier |
dc.contributor.author | Vellvehi, Miquel |
dc.contributor.author | Madrid, Francesc |
dc.contributor.author | Altet Sanahujes, Josep |
dc.date | 2010 |
dc.identifier.citation | Jordà, X. [et al.]. High-power test device for package thermal assessment and validation of thermal measuremetn tecniques. A: 16th International workshop on Thermal investigations of ICs and Systems. "16th THERMINIC". Barcelona: IEEE Computer Society Publications, 2010, p. 90-93. |
dc.identifier.citation | 978-2-35500-012-6 |
dc.identifier.uri | http://hdl.handle.net/2117/10519 |
dc.language.iso | eng |
dc.publisher | IEEE Computer Society Publications |
dc.rights | info:eu-repo/semantics/openAccess |
dc.subject | Àrees temàtiques de la UPC::Enginyeria electrònica |
dc.subject | Thermal test chips |
dc.subject | Resistance temperature detector |
dc.subject | Electronics |
dc.subject | Electrònica |
dc.title | High-power test device for package thermal assessment and validation of thermal measuremetn tecniques |
dc.type | info:eu-repo/semantics/publishedVersion |
dc.type | info:eu-repo/semantics/conferenceObject |
dc.description.abstract |