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dc.contributor | Universitat Politècnica de Catalunya. Departament d'Enginyeria Electrònica |
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dc.contributor | Universitat Politècnica de Catalunya. QINE - Disseny de Baix Consum, Test, Verificació i Circuits Integrats de Seguretat |
dc.contributor.author | Arumi Delgado, Daniel |
dc.contributor.author | Rodríguez Montañés, Rosa |
dc.contributor.author | Figueras Pàmies, Joan |
dc.date | 2015-08-07 |
dc.identifier.citation | Arumi, D., Rodriguez, R., Figueras, J. Prebond testing of weak defects in TSVs. "IEEE transactions on very large scale integration (VLSI) systems", 07 Agost 2015, vol. PP, núm. 99, p. 31-36. |
dc.identifier.citation | 1063-8210 |
dc.identifier.citation | 10.1109/TVLSI.2015.2448594 |
dc.identifier.uri | http://hdl.handle.net/2117/78462 |
dc.language.iso | eng |
dc.relation | http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=7182374 |
dc.rights | info:eu-repo/semantics/openAccess |
dc.subject | Àrees temàtiques de la UPC::Enginyeria electrònica |
dc.subject | Stability |
dc.subject | Electric inverters |
dc.subject | Integrated circuits |
dc.subject | Built-in self-test |
dc.subject | Circuit faults |
dc.subject | Circuit stability |
dc.subject | Inverters |
dc.subject | Stability analysis |
dc.subject | Through-silicon vias |
dc.subject | Built-in self-test (BIST) |
dc.subject | design for testability |
dc.subject | integrated circuit (IC) testing |
dc.subject | Circuits integrats |
dc.title | Prebond testing of weak defects in TSVs |
dc.type | info:eu-repo/semantics/publishedVersion |
dc.type | info:eu-repo/semantics/article |
dc.description.abstract |