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Four different approaches for the measurement of IC surface temperature: Application to thermal testing
Saulnier, J.B; Altet Sanahujes, Josep; Dilhaire, Stefan; Volz, S.; Rampnoux, J.M.; Rubio Sola, Jose Antonio; Grauby, S.; Patino, L.; Claeys, W.
Universitat Politècnica de Catalunya. Departament d'Enginyeria Electrònica; Universitat Politècnica de Catalunya. HIPICS - Grupo de Circuitos y Sistemas Integrados de Altas Prestaciones
Silicon die surface temperature can be used to monitor the health state of digital and analogue integrated circuits (IC). In the present paper, four different sensing techniques: scanning thermal microscope, laser reflectometer, laser interferometer and electronic built-in differential temperature sensors are used to measure the temperature at the surface of the same IC containing heat sources (hot spots) that behave as faulty digital gates. The goal of the paper is to describe the techniques as well as to present the performances of these sensing methods for the detection and localisation of hot spots in an IC. q 2002 Elsevier Science Ltd All rights reserved.
Àrees temàtiques de la UPC::Enginyeria electrònica
Scanning thermal microscopy
Laser reflectometry
Laser interferometry
Built-in temperature sensors
Integrated circuits
Electronic engineering
Circuits integrats
Enginyeria electrònica
Attribution-NonCommercial-NoDerivs 3.0 Spain

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