Four different approaches for the measurement of IC surface temperature: Application to thermal testing

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dc.contributor	Universitat Politècnica de Catalunya. Departament d'Enginyeria Electrònica
dc.contributor	Universitat Politècnica de Catalunya. HIPICS - Grup de Circuits i Sistemes Integrats d'Altes Prestacions
dc.contributor.author	Saulnier, J.B
dc.contributor.author	Altet Sanahujes, Josep
dc.contributor.author	Dilhaire, Stefan
dc.contributor.author	Volz, S.
dc.contributor.author	Rampnoux, J.M.
dc.contributor.author	Rubio Sola, Jose Antonio
dc.contributor.author	Grauby, S.
dc.contributor.author	Patino, L.
dc.contributor.author	Claeys, W.
dc.date	2002-09
dc.identifier.citation	Altet, J. [et al.]. Four different approaches for the measurement of IC surface temperature: Application to thermal testing. "Microelectronics journal", Setembre 2002, vol. 33, p. 689-696.
dc.identifier.citation	0026-2692
dc.identifier.uri	http://hdl.handle.net/2117/10920
dc.language.iso	eng
dc.rights	Attribution-NonCommercial-NoDerivs 3.0 Spain
dc.rights	info:eu-repo/semantics/openAccess
dc.rights	http://creativecommons.org/licenses/by-nc-nd/3.0/es/
dc.subject	Àrees temàtiques de la UPC::Enginyeria electrònica
dc.subject	Scanning thermal microscopy
dc.subject	Laser reflectometry
dc.subject	Laser interferometry
dc.subject	Built-in temperature sensors
dc.subject	Integrated circuits
dc.subject	Electronic engineering
dc.subject	Circuits integrats
dc.subject	Enginyeria electrònica
dc.title	Four different approaches for the measurement of IC surface temperature: Application to thermal testing
dc.type	info:eu-repo/semantics/publishedVersion
dc.type	info:eu-repo/semantics/article
dc.description.abstract	Silicon die surface temperature can be used to monitor the health state of digital and analogue integrated circuits (IC). In the present paper, four different sensing techniques: scanning thermal microscope, laser reflectometer, laser interferometer and electronic built-in differential temperature sensors are used to measure the temperature at the surface of the same IC containing heat sources (hot spots) that behave as faulty digital gates. The goal of the paper is to describe the techniques as well as to present the performances of these sensing methods for the detection and localisation of hot spots in an IC. q 2002 Elsevier Science Ltd All rights reserved.

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