Benchmarking emerging cavity-mediated quantum interconnect technologies for modular quantum computers

Abstract

Modularity is a promising approach for scaling up quantum computers and, therefore, integrating higher qubit counts. The essence of such architectures lies in their reliance on high-¿delity and fast quantum state transfers enabled by generating entanglement between chips. In addressing the challenge of implementing quantum coherent communication channels to interconnect quantum processors, various techniques have been proposed to account for qubit technology specifications and the implemented communication protocol. By employing DesignSpace Exploration (DSE) methodologies, this work presents a comparative analysis of cavity-mediated interconnect technologies according to a defined figure of merit. We identify the configurations related to the cavity and atomic decay rates, as well as the qubit-cavity coupling strength, that meet the efficiency thresholds. We therefore contribute to benchmarking contemporary cavity-mediated quantum interconnects and guide the development of reliable and scalable chip-to-chip links for modular quantum computers.

We gratefully acknowledge funding from the European Commission through HORIZON-EIC-2022-PATHFINDEROPEN-01- 101099697 (QUADRATURE) and grant HORIZON-ERC-2021-101042080 (WINC). Authors acknowledge support from the QCOMM-CAT-Planes Complementarios: Comunicación Cuántica - supported by MICIN with funding from the European Union, NextGenerationEU (PRTR-C17.I1) and by Generalitat de Catalunya, and by ICREA Academia Award 2024. CGA also acknowledges funding from the Spanish Ministry of Science, Innovation and Universities through the Beatriz Galindo program 2020 (BG20-00023).

Peer Reviewed

Postprint (author's final draft)