Título:
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Millimeter-wave propagation within a computer chip package
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Autor/a:
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Timoneda, Xavier; Abadal Cavallé, Sergi; Cabellos Aparicio, Alberto; Manessis, Dionyssios; Zhou, Jin; Franques, Antonio; Torrellas, Josep; Alarcón Cot, Eduardo José
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Otros autores:
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Universitat Politècnica de Catalunya. Departament d'Arquitectura de Computadors; Universitat Politècnica de Catalunya. Departament d'Enginyeria Electrònica; Universitat Politècnica de Catalunya. CBA - Sistemes de Comunicacions i Arquitectures de Banda Ampla; Universitat Politècnica de Catalunya. EPIC - Energy Processing and Integrated Circuits |
Abstract:
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Abstract:
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Wireless Network-on-Chip (WNoC) appears as a promising alternative to conventional interconnect fabrics for chip-scale communications. The WNoC paradigm has been extensively analyzed from the physical, network and architecture perspectives assuming mmWave band operation. However, there has not been a comprehensive study at this band for realistic chip packages and, thus, the characteristics of such wireless channel remain not fully understood. This work addresses this issue by accurately modeling a flip-chip package and investigating the wave propagation inside it. Through parametric studies, a locally optimal configuration for 60 GHz WNoC is obtained, showing that chip-wide attenuation below 32.6 dB could be achieved with standard processes. Finally, the applicability of the methodology is discussed for higher bands and other integrated environments such as a Software-Defined Metamaterial (SDM). |
Abstract:
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Peer Reviewed |
Materia(s):
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-Àrees temàtiques de la UPC::Enginyeria de la telecomunicació::Radiocomunicació i exploració electromagnètica::Antenes i agrupacions d'antenes -Àrees temàtiques de la UPC::Enginyeria electrònica::Microelectrònica::Circuits integrats -Antennas (Electronics) -Integrated circuits -Antennas -Silicon -Integrated circuit interconnections -Wires -Heat sinks -Ceramics -Wireless communication -Antenes (Electrònica) -Circuits integrats |
Derechos:
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Tipo de documento:
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Artículo - Versión presentada Objeto de conferencia |
Editor:
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Institute of Electrical and Electronics Engineers (IEEE)
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