Title:
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3D metallo-dielectric structures combining electrochemical and electroplating techniques
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Author:
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Hernández Díaz, David; Lange, D.; Todorov Trifonov, Trifon; Garin Escriva, Moises; García Molina, Francisco Miguel; Rodríguez Martínez, Ángel; Alcubilla González, Ramón
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Other authors:
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Universitat Politècnica de Catalunya. Departament d'Enginyeria Electrònica; Universitat Politècnica de Catalunya. MNT - Grup de Recerca en Micro i Nanotecnologies |
Abstract:
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Three-dimensional (3D) periodic nickel micro-structures with a periodicity of 4 μm and high number of structural periods were fabricated by electrodeposition. Macroporous silicon, consisting of periodic arrays of sine-wave modulated pores, was used as a deposition template. It was prepared by electrochemical etching of silicon and subsequent pore widening by multiple oxidation/oxide-removal steps. The pore widening allows to open windows between adjacent pores obtaining a 3D network of interconnected voids embedded in silicon. This structure is then void-free filled with nickel in the electroplating process. The combination of electrochemical etching and electroplating techniques opens a route for the fabrication of large-scale 3D-periodic metallic micro-structures. |
Abstract:
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Peer Reviewed |
Subject(s):
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-Electroplating -Photonic crystals -Microelectrònica -- Materials |
Rights:
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Document type:
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Article - Published version Article |
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