Refueling: Preventing wire degradation due to electromigration

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Título:	Refueling: Preventing wire degradation due to electromigration
Autor/a:	Abella Ferrer, Jaume; Vera Rivera, Francisco Javier; Unsal, Osman Sabri; Ergin, Oguz; González Colás, Antonio María; Tschanz, James W.
Otros autores:	Universitat Politècnica de Catalunya. Departament d'Arquitectura de Computadors; Universitat Politècnica de Catalunya. ARCO - Microarquitectura i Compiladors
Abstract:	Electromigration is a major source of wire and via failure. Refueling undoes EM for bidirectional wires and power/ground grids-some of a chip's most vulnerable wires. Refueling exploits EM's self-healing effect by balancing the amount of current flowing in both directions of a wire. It can significantly extend a wire's lifetime while reducing the chip area devoted to wires.
Abstract:	Peer Reviewed
Materia(s):	-Àrees temàtiques de la UPC::Informàtica::Arquitectura de computadors -Integrated circuits -Failure analysis -Electromigration -Circuits integrats
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Tipo de documento:	Artículo - Versión publicada Artículo
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Unsal, Osman Sabri; Tschanz, James W.; Bowman, Keith; De, Vivek; Vera Rivera, Francisco Javier; González Colás, Antonio María; Ergin, Oguz

Abella Ferrer, Jaume; Vera Rivera, Francisco Javier; Unsal, Osman Sabri; Ergin, Oguz; González Colás, Antonio María

Ergin, Oguz; Unsal, Osman Sabri; Vera Rivera, Francisco Javier; González Colás, Antonio María

Unsal, Osman Sabri; Ergin, Oguz; Vera Rivera, Francisco Javier; González Colás, Antonio María

Ergin, Oguz; Unsal, Osman Sabri; Vera Rivera, Francisco Javier; González Colás, Antonio María

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