The implementation of the Chemical Solution Deposition (CSD) methodology with 23 the Drop on Demand (DoD) inkjet printing (IJP) technology has been successfully employed to 24 develop a Solution Deposition Planarization (SDP) method. We have used nanocrystalline yttrium 25 oxide (Y₂O₃) to decrease the roughness of technical metallic substrates by filling the surface 26 imperfections and thus avoiding costly polishing steps. This alternative process represents an 27 outstanding methodology to reduce the final cost of the 2G coated conductors manufacturing. 28 Two Y₂O₃ metalorganic precursor inks formulations were successfully developed and tested to 29 obtain surfaces as smooth as possible with adequate mechanical properties to hold the internal 30 stresses developed during the subsequent layers growth. 31 By using these inks as precursors for IJP and after a proper tuning of the rheological and 32 wetting parameters, we firstly obtained short length uniform 100nm-thick Y₂O₃-SDP films on 33 unpolished stainless steel substrate from Bruker HTS. The scalability of the reel to reel (R2R)-IJP 34 process to 100m is then demonstrated on metallic substrates as well. A complete characterization of 35 the prepared short and long length SDP-Y₂O₃ inkjet-printed layers was carried out by optical 36 microscopy, FIB-SEM (Focus Ion Beam coupled to Scanning Electron Microscopy), XRD (X-Ray 37 Diffraction), AFM (Atomic Force Microscopy), reflectometry and nanoindentation techniques. Then, 38 the morphology, thickness, crystallinity and mechanical properties were evaluated, together with 39 the surface roughness in order to assess the resulting layer planarity. The impact of planarity was 40 additionally studied via growth of biaxially textured buffer layers as well as further functional 41 layers. 1.1µm-thick YSZ layers with in-plane textures better than the SS polished reference were 42 successfully deposited on top of the 100 nm SDP-Y2O3 films yielding 50% of Ic in contrast to the 43 standard reference.