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Title:
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Dynamic Compact Thermal Models With Multiple Power Sources: Application to an Ultrathin Chip Stacking Technology
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Author:
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Palacín Roca, Jordi; Salleras, Marc; Samitier, Josep; Marco, Santiago
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Notes:
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Whereas numerical modeling using finite-element
methods (FEM) can provide transient temperature distribution in
the component with enough accuracy, it is of the most importance
the development of compact dynamic thermal models that can
be used for electrothermal simulation. While in most cases single
power sources are considered, here we focus on the simultaneous
presence of multiple sources. The thermal model will be in the
form of a thermal impedance matrix containing the thermal
impedance transfer functions between two arbitrary ports. Each
individual transfer function element ( ) is obtained from the
analysis of the thermal temperature transient at node “ ” after
a power step at node “ .” Different options for multiexponential
transient analysis are detailed and compared. Among the options
explored, small thermal models can be obtained by constrained
nonlinear least squares (NLSQ) methods if the order is selected
properly using validation signals. The methods are applied to the
extraction of dynamic compact thermal models for a new ultrathin
chip stack technology (UTCS). |
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Subject(s):
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-Dynamic compact thermal models
-Modeling
-Thin electronics |
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Rights:
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(c) IEEE, 2005
info:eu-repo/semantics/restrictedAccess |
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Document type:
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article
publishedVersion |
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Published by:
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Institute of Electrical and Electronics Engineers
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Share:
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