Title:
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Two-port networks to model galvanic coupling for intrabody communications and power transfer to implants
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Author:
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Ivorra Cano, Antoni, 1974-; Becerra-Fajardo, Laura; Tudela-Pi, Marc; Ivorra Cano, Antoni, 1974-
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Abstract:
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Comunicació presentada a: BioCAS 2018, celebrada a Cleveland, Ohio, Estats Units d'Amèrica, del 17 al 19 d'octubre de 2018. |
Abstract:
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Galvanic coupling, or more precisely, volume
conduction, can be used to communicate with and to transfer
power to electronic implants. Since no bulky components for
power, such as coils or batteries, are required within the
implants, this strategy can yield very thin devices suitable for
implantation by injection. To design the circuitry of both the
implants and the external systems, it is desirable to possess a
model that encompasses the behavior of these circuits and also
the volume conduction phenomenon. Here we propose to model
volume conduction with a two-port network so that the whole
system can be studied in circuit simulators. The two-port
network consists only of three impedances whose values can be
obtained through simple measurements or through numerical
methods. We report a validation of this modeling approach in a
geometrically simple in vitro setup that allowed us to
determine the impedances of the two-port network not only by
performing measurements or through a finite element method
study but also through an analytical solution. |
Abstract:
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Research Council (ERC) under the European Union’s Horizon 2020 research and innovation programme (grant agreement No 724244). |
Subject(s):
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-Galvanic coupling -Volume conduction -Neuroprosthetics -Implants -Power transfer -SPICE |
Rights:
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© 2018 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
The final published article can be found at https://ieeexplore.ieee.org/document/8584691
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Document type:
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Conference Object Article - Accepted version |
Published by:
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Institute of Electrical and Electronics Engineers (IEEE)
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