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dc.contributor | Universitat de Barcelona |
---|---|
dc.contributor.author | Pinel, Stèphane |
dc.contributor.author | Marty, Antoine |
dc.contributor.author | Tasselli, Josiane |
dc.contributor.author | Bailbe, Jean-Pierre |
dc.contributor.author | Beyne, Eric |
dc.contributor.author | Van Hoof, Rita |
dc.contributor.author | Marco Colás, Santiago |
dc.contributor.author | Morante i Lleonart, Joan Ramon |
dc.contributor.author | Vendier, Olivier |
dc.contributor.author | Huan, Marc |
dc.date | 2009-06-18T08:31:52Z |
dc.date | 2009-06-18T08:31:52Z |
dc.date | 2002 |
dc.identifier.citation | 1521-3331 |
dc.identifier.citation | 505014 |
dc.identifier.uri | http://hdl.handle.net/2445/8724 |
dc.format | 10 p. |
dc.format | application/pdf |
dc.language.iso | eng |
dc.publisher | IEEE |
dc.relation | Reproducció del document publicat a http://dx.doi.org/10.1109/TCAPT.2002.1010013 |
dc.relation | IEEE Transactions on Components Packaging and Technologies, 2002, vol. 25, núm. 2, p. 244-253. |
dc.relation | http://dx.doi.org/10.1109/TCAPT.2002.1010013 |
dc.rights | (c) IEEE, 2002 |
dc.rights | info:eu-repo/semantics/openAccess |
dc.subject | Anàlisi tèrmica |
dc.subject | Administració |
dc.subject | Finite element analysis |
dc.subject | Thermal conductivity |
dc.subject | Thermal management (packaging) |
dc.title | Thermal modeling and management in ultrathin chip stack technology |
dc.type | info:eu-repo/semantics/article |
dc.type | info:eu-repo/semantics/publishedVersion |
dc.description.abstract |