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dc.contributor | Universitat de Barcelona |
---|---|
dc.contributor.author | Leseduarte Cuevas, Sergio |
dc.contributor.author | Marco Colás, Santiago |
dc.contributor.author | Beyne, Eric |
dc.contributor.author | Van Hoof, Rita |
dc.contributor.author | Marty, Antoine |
dc.contributor.author | Pinel, Stèphane |
dc.contributor.author | Vendier, Olivier |
dc.contributor.author | Coello-Vera, Augustín |
dc.date | 2009-06-17T09:09:54Z |
dc.date | 2009-06-17T09:09:54Z |
dc.date | 2000 |
dc.identifier.citation | 1521-3331 |
dc.identifier.citation | 154101 |
dc.identifier.uri | http://hdl.handle.net/2445/8692 |
dc.format | 7 p. |
dc.format | application/pdf |
dc.language.iso | eng |
dc.publisher | IEEE |
dc.relation | Reproducció del document publicat a http://dx.doi.org/10.1109/6144.888852 |
dc.relation | IEEE Transactions on Components Packaging and Manufacturing Technology Part A, 2000, vol. 23, núm. 4, p. 673-679. |
dc.relation | http://dx.doi.org/10.1109/6144.888852 |
dc.rights | (c) IEEE, 2000 |
dc.rights | info:eu-repo/semantics/openAccess |
dc.subject | Delamination |
dc.subject | Finite element analysis |
dc.subject | Integrated circuit design |
dc.subject | Integrated circuit interconnections |
dc.subject | Integrated circuit packaging |
dc.subject | Thermal stresses |
dc.subject | Circuits integrals |
dc.title | Residual thermomechanical stresses in thinned-chip assemblies |
dc.type | info:eu-repo/semantics/article |
dc.type | info:eu-repo/semantics/publishedVersion |
dc.description.abstract |