An extremely thin and robust interconnecting layer providing 76% fill factor in a tandem polymer solar cell architecture

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Title:	An extremely thin and robust interconnecting layer providing 76% fill factor in a tandem polymer solar cell architecture
Author:	Martinez Otero, Alberto; Liu, Quansheng; Mantilla Perez, Paola; Montes Bajo, Miguel; Martorell Pena, Jordi
Other authors:	Universitat Politècnica de Catalunya. Departament de Física; Universitat Politècnica de Catalunya. DONLL - Dinàmica no Lineal, Òptica no Lineal i Làsers
Abstract:	We report a thin and robust interconnecting layer (ICL) for polymer tandem solar cells. This ICL shows low absorption, good electrical contacts, large work function contrast and robustness. Its use yields tandem cells with a very high fill factor of 76%, making this ICL a promising component of future highly efficient multijunction organic solar cells.
Abstract:	Peer Reviewed
Subject(s):	-Àrees temàtiques de la UPC::Física -Àrees temàtiques de la UPC::Energies::Energia solar fotovoltaica -Photovoltaic power generation -Solar cells -Low-bandgap polymer -Power conversion efficiency -Organic electronics -Photovoltaic cells -Interfacial layer -Enhancement -Transport -Design -Donors -Energia solar fotovoltaica -Cèl·lules solars
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Document type:	Article - Submitted version Article
Published by:	Royal Society of Chemistry
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