Non-invasive Monitoring of CMOS Power Amplifiers Operating at RF and mmW Frequencies using an On-chip Thermal Sensor

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To access the full text documents, please follow this link: http://hdl.handle.net/2117/13185

dc.contributor	Universitat Politècnica de Catalunya. Departament d'Enginyeria Electrònica
dc.contributor	Universitat Politècnica de Catalunya. HIPICS - Grup de Circuits i Sistemes Integrats d'Altes Prestacions
dc.contributor.author	González Jiménez, José Luis
dc.contributor.author	Martineau, Baudouin
dc.contributor.author	Mateo Peña, Diego
dc.contributor.author	Altet Sanahujes, Josep
dc.date	2011
dc.identifier.citation	González, J. [et al.]. Non-invasive Monitoring of CMOS Power Amplifiers Operating at RF and mmW Frequencies using an On-chip Thermal Sensor. A: IEEE Radio Frequency Integrated Circuits Symposium. "RFIC 2011". Baltimore: IEEE Press. Institute of Electrical and Electronics Engineers, 2011, p. 1-4.
dc.identifier.citation	9781424482900
dc.identifier.citation	10.1109/RFIC.2011.5940624
dc.identifier.citation	CFP11MMW-PRT
dc.identifier.uri	http://hdl.handle.net/2117/13185
dc.language.iso	eng
dc.publisher	IEEE Press. Institute of Electrical and Electronics Engineers
dc.relation	http://ieeexplore.ieee.org/search/srchabstract.jsp?tp=&arnumber=5940624&queryText%3DRFIC+altet%26openedRefinements%3D*%26filter%3DAND%28NOT%284283010803%29%29%26searchField%3DSearch+All
dc.rights	Attribution-NonCommercial-NoDerivs 3.0 Spain
dc.rights	info:eu-repo/semantics/openAccess
dc.rights	http://creativecommons.org/licenses/by-nc-nd/3.0/es/
dc.subject	Àrees temàtiques de la UPC::Enginyeria electrònica::Components electrònics::Transistors
dc.subject	Àrees temàtiques de la UPC::Enginyeria de la telecomunicació::Radiocomunicació i exploració electromagnètica::Circuits de microones, radiofreqüència i ones mil·limètriques
dc.subject	Integrated circuits
dc.subject	Transistors
dc.subject	Transistors
dc.subject	Circuits integrats
dc.title	Non-invasive Monitoring of CMOS Power Amplifiers Operating at RF and mmW Frequencies using an On-chip Thermal Sensor
dc.type	info:eu-repo/semantics/publishedVersion
dc.type	info:eu-repo/semantics/conferenceObject
dc.description.abstract	In this paper a non-invasive, contact-less technique for the on-chip observation of PA operation is presented. It uses a differential temperature sensor that transduces the temperature increase due to the power dissipated by active transistors operating at high frequencies into a low frequency signal that is proportional to some relevant PA figures of merit, such as output power or PAE. The technique is demonstrated by using the same thermal sensor in two different PAs (a 2 GHz PA and a 60 GHz PA) implemented with a 65 nm CMOS process.
dc.description.abstract	Peer Reviewed

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