Title:
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High-power test device for package thermal assessment and validation of thermal measuremetn tecniques
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Author:
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Jordà, Xavier; Perpiñà, Xavier; Vellvehi, Miquel; Madrid, Francesc; Altet Sanahujes, Josep
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Other authors:
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Universitat Politècnica de Catalunya. Departament d'Enginyeria Electrònica; Universitat Politècnica de Catalunya. HIPICS - Grup de Circuits i Sistemes Integrats d'Altes Prestacions |
Abstract:
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This paper describes the structure and thermal
behavior of a high-power thermal test chip (up to 200 W/cm2)
designed for power electronics package assessment, which has
also been used for the validation of thermal measurement
techniques. In particular, we show two application examples
where the proposed device allowed the assessment of different
power substrate technologies, and the validation of temperature
measurement techniques used to characterize the high
frequency behavior of circuits and devices in the frequency
domain using the heterodyne technique. |
Subject(s):
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-Àrees temàtiques de la UPC::Enginyeria electrònica -Thermal test chips -Resistance temperature detector -Electronics -Electrònica |
Rights:
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Document type:
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Article - Published version Conference Object |
Published by:
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IEEE Computer Society Publications
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