Para acceder a los documentos con el texto completo, por favor, siga el siguiente enlace: http://hdl.handle.net/2117/10519

High-power test device for package thermal assessment and validation of thermal measuremetn tecniques
Jordà, Xavier; Perpiñà, Xavier; Vellvehi, Miquel; Madrid, Francesc; Altet Sanahujes, Josep
Universitat Politècnica de Catalunya. Departament d'Enginyeria Electrònica; Universitat Politècnica de Catalunya. HIPICS - Grupo de Circuitos y Sistemas Integrados de Altas Prestaciones
This paper describes the structure and thermal behavior of a high-power thermal test chip (up to 200 W/cm2) designed for power electronics package assessment, which has also been used for the validation of thermal measurement techniques. In particular, we show two application examples where the proposed device allowed the assessment of different power substrate technologies, and the validation of temperature measurement techniques used to characterize the high frequency behavior of circuits and devices in the frequency domain using the heterodyne technique.
Àrees temàtiques de la UPC::Enginyeria electrònica
Thermal test chips
Resistance temperature detector
Electronics
Electrònica
info:eu-repo/semantics/publishedVersion
info:eu-repo/semantics/conferenceObject
IEEE Computer Society Publications
         

Mostrar el registro completo del ítem

Documentos relacionados

Otros documentos del mismo autor/a

Perpiñà, Xavier; Altet Sanahujes, Josep; Jordà, Xavier; Vellvehi, Miquel
Perpiñà, Xavier; Altet Sanahujes, Josep; Jordà, Xavier; Vellvehi, Miquel
Perpiñà, Xavier; Altet Sanahujes, Josep; Jordà, Xavier; Vellvehi, Miquel; Mestres, Narcís
Altet Sanahujes, Josep; González Jiménez, José Luis; Gómez Salinas, Dídac; Perpiñà, Xavier; Grauby, Stephane; Dufis, Cédric Yvan; Vellvehi, Miquel; Mateo Peña, Diego; Dilhaire, Stefan; Jordà, Xavier