2026-04-13T06:45:51Zhttps://recercat.cat/oai/request

oai:recercat.cat:2445/987592025-12-05T14:47:45Zcom_2072_1057col_2072_478821col_2072_478917

00925njm 22002777a 4500 dc Izquierdo, Ricardo author Bertomeu i Balagueró, Joan author Suys, Marc author Sacher, Edward author Meunier, Michel author 2016-05-23T13:58:55Z 2016-05-23T13:58:55Z 1995 2016-05-12T13:28:06Z Copper films have been deposited on TiN and fluoropolymer substrates from the KrF excimer-laser-assisted decomposition of Cu(hfac)(TMVS). Using H2 as the carrier gas, very uniform, shiny metal-like films were deposited with grain size of 50 to 100 nm. XPS measurements show that the precursor is reduced to metallic copper, and that a Cu/C atomic ratio of up to 17 is obtained. Coure Làsers Pel·lícules metàl·liques Copper Lasers Metallic films Excimer laser induced deposition of copper from Cu(hfac)(TMVS)