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               <dc:title>Very compact 3D-printed folded branch-line hybrid coupler based on loaded helical-microstrip transmission lines</dc:title>
               <dc:creator>Salas Barenys, Arnau</dc:creator>
               <dc:creator>Vidal Martínez, Neus</dc:creator>
               <dc:creator>López Villegas, José María</dc:creator>
               <dc:subject>Impressió 3D</dc:subject>
               <dc:subject>Radiofreqüència</dc:subject>
               <dc:subject>Topologia</dc:subject>
               <dc:subject>Three-dimensional printing</dc:subject>
               <dc:subject>Radio frequency</dc:subject>
               <dc:subject>Topology</dc:subject>
               <dc:description>This paper presents a 3D topology for high miniaturization of the well-known hybrid branch-line coupler at the UHF band. A preliminary work already proposed the use of helical-microstrip TLs combined with a folded structure for this purpose. This extended work includes a compactness enhancement by loading the TL segments with capacitors. An study of loaded helical-microstrip TL is reported as well. The coupler prototypes have been simulated and fabricated by using a combination of Additive Manufacturing and copper electroplating. The performance results have been compared to the conventional model showing a good agreement. In order to place the designed devices within the state of the art a figure of merit that combines the compactness and the relative bandwidth has been proposed, showing very good results in terms of miniaturization.</dc:description>
               <dc:date>2024-06-21T14:07:36Z</dc:date>
               <dc:date>2024-06-21T14:07:36Z</dc:date>
               <dc:date>2022-02-12</dc:date>
               <dc:date>2024-06-21T14:07:41Z</dc:date>
               <dc:type>info:eu-repo/semantics/article</dc:type>
               <dc:type>info:eu-repo/semantics/publishedVersion</dc:type>
               <dc:relation>Reproducció del document publicat a:</dc:relation>
               <dc:relation>Integration, the VLSI Journal, 2022, num.84, p. 142-150</dc:relation>
               <dc:rights>cc-by-nc-nd (c) Salas Barenys, Arnau, et al., 2022</dc:rights>
               <dc:rights>http://creativecommons.org/licenses/by-nc-nd/4.0/</dc:rights>
               <dc:rights>info:eu-repo/semantics/openAccess</dc:rights>
               <dc:publisher>Elsevier</dc:publisher>
               <dc:source>Articles publicats en revistes (Enginyeria Electrònica i Biomèdica)</dc:source>
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