<?xml version="1.0" encoding="UTF-8"?><?xml-stylesheet type="text/xsl" href="static/style.xsl"?><OAI-PMH xmlns="http://www.openarchives.org/OAI/2.0/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.openarchives.org/OAI/2.0/ http://www.openarchives.org/OAI/2.0/OAI-PMH.xsd"><responseDate>2026-04-17T13:50:34Z</responseDate><request verb="GetRecord" identifier="oai:www.recercat.cat:2445/140382" metadataPrefix="mets">https://recercat.cat/oai/request</request><GetRecord><record><header><identifier>oai:recercat.cat:2445/140382</identifier><datestamp>2025-12-04T20:58:42Z</datestamp><setSpec>com_2072_1057</setSpec><setSpec>col_2072_478796</setSpec><setSpec>col_2072_478917</setSpec></header><metadata><mets xmlns="http://www.loc.gov/METS/" xmlns:xlink="http://www.w3.org/1999/xlink" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns:doc="http://www.lyncode.com/xoai" ID="&#xa;&#x9;&#x9;&#x9;&#x9;DSpace_ITEM_2445-140382" TYPE="DSpace ITEM" PROFILE="DSpace METS SIP Profile 1.0" xsi:schemaLocation="http://www.loc.gov/METS/ http://www.loc.gov/standards/mets/mets.xsd" OBJID="&#xa;&#x9;&#x9;&#x9;&#x9;hdl:2445/140382">
   <metsHdr CREATEDATE="2026-04-17T05:57:38Z">
      <agent ROLE="CUSTODIAN" TYPE="ORGANIZATION">
         <name>RECERCAT</name>
      </agent>
   </metsHdr>
   <dmdSec ID="DMD_2445_140382">
      <mdWrap MDTYPE="MODS">
         <xmlData xmlns:mods="http://www.loc.gov/mods/v3" xsi:schemaLocation="http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-1.xsd">
            <mods:mods xsi:schemaLocation="http://www.loc.gov/mods/v3 http://www.loc.gov/standards/mods/v3/mods-3-1.xsd">
               <mods:name>
                  <mods:role>
                     <mods:roleTerm type="text">author</mods:roleTerm>
                  </mods:role>
                  <mods:namePart>Serrà i Ramos, Albert</mods:namePart>
               </mods:name>
               <mods:name>
                  <mods:role>
                     <mods:roleTerm type="text">author</mods:roleTerm>
                  </mods:role>
                  <mods:namePart>Coleman, Simon J.</mods:namePart>
               </mods:name>
               <mods:name>
                  <mods:role>
                     <mods:roleTerm type="text">author</mods:roleTerm>
                  </mods:role>
                  <mods:namePart>Gómez, Elvira</mods:namePart>
               </mods:name>
               <mods:name>
                  <mods:role>
                     <mods:roleTerm type="text">author</mods:roleTerm>
                  </mods:role>
                  <mods:namePart>Green, Todd A.</mods:namePart>
               </mods:name>
               <mods:name>
                  <mods:role>
                     <mods:roleTerm type="text">author</mods:roleTerm>
                  </mods:role>
                  <mods:namePart>Vallés Giménez, Elisa</mods:namePart>
               </mods:name>
               <mods:name>
                  <mods:role>
                     <mods:roleTerm type="text">author</mods:roleTerm>
                  </mods:role>
                  <mods:namePart>Vilana i Balastegui, Joan</mods:namePart>
               </mods:name>
               <mods:name>
                  <mods:role>
                     <mods:roleTerm type="text">author</mods:roleTerm>
                  </mods:role>
                  <mods:namePart>Roy, Sudipta</mods:namePart>
               </mods:name>
               <mods:originInfo>
                  <mods:dateIssued encoding="iso8601">2019-09-18T09:47:59Z2019-09-18T09:47:59Z2016-04-302019-09-18T09:47:59Z</mods:dateIssued>
               </mods:originInfo>
               <mods:identifier type="none"/>
               <mods:abstract>The EnFACE technology has been demonstrated as a successful mask-less electrodeposition method to transfer millimetre and micrometre-scale copper patterns on to A7-sized rectangular plates. This is the first successful demonstration of this technique using large substrates. A patterned anode tool was used to transfer electrodepositedpatterns onto anun-patterned cathode by maintaining very narrow separation (300 µm) between the two electrodes and agitating the fluid in the inter-electrode gap by ultrasonic means. A non-acidic copper solution with a low content of metal ions and additives was used.Limiting current experiments were initially performed to demonstrate that improved and uniform agitation could be maintained within the inter-electrode gap at relatively low ultrasonic powers of 5 to 30 W L-1. The best pattern definition was obtained at a US power of 5 W L-1and a current density of 20 mA cm-2. Importantly, the resultsobtained were comparable to those obtained by conventional through-mask plating. A single anode tool could be used to pattern up to five substrates, substantially minimising the amount of lithographic processingrequired. These results suggest that the EnFACE techniqueis a usefulmask-less microfabrication process for pattern transfer on to large substrates.</mods:abstract>
               <mods:language>
                  <mods:languageTerm authority="rfc3066"/>
               </mods:language>
               <mods:accessCondition type="useAndReproduction">cc-by-nc-nd (c) Elsevier Ltd, 2016 http://creativecommons.org/licenses/by-nc-nd/3.0/es info:eu-repo/semantics/openAccess</mods:accessCondition>
               <mods:subject>
                  <mods:topic>Coure</mods:topic>
               </mods:subject>
               <mods:subject>
                  <mods:topic>Galvanoplàstia</mods:topic>
               </mods:subject>
               <mods:subject>
                  <mods:topic>Microestructura</mods:topic>
               </mods:subject>
               <mods:subject>
                  <mods:topic>Copper</mods:topic>
               </mods:subject>
               <mods:subject>
                  <mods:topic>Electroplating</mods:topic>
               </mods:subject>
               <mods:subject>
                  <mods:topic>Microstructure</mods:topic>
               </mods:subject>
               <mods:titleInfo>
                  <mods:title>Sono-electrodeposition transfer of micro-scale copper patterns on to A7 substrates using a mask-less method</mods:title>
               </mods:titleInfo>
               <mods:genre>info:eu-repo/semantics/article info:eu-repo/semantics/acceptedVersion</mods:genre>
            </mods:mods>
         </xmlData>
      </mdWrap>
   </dmdSec>
   <structMap LABEL="DSpace Object" TYPE="LOGICAL">
      <div TYPE="DSpace Object Contents" ADMID="DMD_2445_140382"/>
   </structMap>
</mets></metadata></record></GetRecord></OAI-PMH>