2026-04-13T02:02:16Zhttps://recercat.cat/oai/request

oai:recercat.cat:2445/1403822025-12-04T20:58:42Zcom_2072_1057col_2072_478796col_2072_478917

urn:hdl:2445/140382 Sono-electrodeposition transfer of micro-scale copper patterns on to A7 substrates using a mask-less method Serrà i Ramos, Albert Coleman, Simon J. Gómez, Elvira Green, Todd A. Vallés Giménez, Elisa Vilana i Balastegui, Joan Roy, Sudipta Coure Galvanoplàstia Microestructura Copper Electroplating Microstructure The EnFACE technology has been demonstrated as a successful mask-less electrodeposition method to transfer millimetre and micrometre-scale copper patterns on to A7-sized rectangular plates. This is the first successful demonstration of this technique using large substrates. A patterned anode tool was used to transfer electrodepositedpatterns onto anun-patterned cathode by maintaining very narrow separation (300 µm) between the two electrodes and agitating the fluid in the inter-electrode gap by ultrasonic means. A non-acidic copper solution with a low content of metal ions and additives was used.Limiting current experiments were initially performed to demonstrate that improved and uniform agitation could be maintained within the inter-electrode gap at relatively low ultrasonic powers of 5 to 30 W L-1. The best pattern definition was obtained at a US power of 5 W L-1and a current density of 20 mA cm-2. Importantly, the resultsobtained were comparable to those obtained by conventional through-mask plating. A single anode tool could be used to pattern up to five substrates, substantially minimising the amount of lithographic processingrequired. These results suggest that the EnFACE techniqueis a usefulmask-less microfabrication process for pattern transfer on to large substrates. 2019-09-18T09:47:59Z 2019-09-18T09:47:59Z 2016-04-30 2019-09-18T09:47:59Z info:eu-repo/semantics/article info:eu-repo/semantics/acceptedVersion Versió postprint del document publicat a: https://doi.org/10.1016/j.electacta.2016.04.003 Electrochimica Acta, 2016, vol. 207, p. 207-217 https://doi.org/10.1016/j.electacta.2016.04.003 cc-by-nc-nd (c) Elsevier Ltd, 2016 http://creativecommons.org/licenses/by-nc-nd/3.0/es info:eu-repo/semantics/openAccess Elsevier Ltd Articles publicats en revistes (Ciència dels Materials i Química Física)