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   <dc:title>Three-level buck converter for envelope tracking applications</dc:title>
   <dc:creator>Yousefzadeh, Vahid</dc:creator>
   <dc:creator>Alarcón Cot, Eduardo José</dc:creator>
   <dc:creator>Maksimovic, Eduard Alarcón And Dragan</dc:creator>
   <dc:subject>Àrees temàtiques de la UPC::Enginyeria electrònica::Electrònica de potència</dc:subject>
   <dc:subject>Power amplifiers</dc:subject>
   <dc:subject>Envelope elimination and restoration (EER)</dc:subject>
   <dc:subject>Radio frequency power amplifier (RFPA)</dc:subject>
   <dc:subject>Three-level buck converter</dc:subject>
   <dc:subject>Amplificadors de potència</dc:subject>
   <dcterms:abstract>This letter proposes a three-level buck converter for tracking applications such as envelope-tracking in radio frequency power amplifiers (RFPAs). It is shown that the three-level buck converter can offer advantages in terms of switching ripples, losses, bandwidth, or the size of magnetic components compared to a standard buck or a two-phase buck converter. Experimental results illustrate improved efficiency and ripple rejection in an RFPA envelope-tracking application representative for low-power battery-operated systems.</dcterms:abstract>
   <dcterms:abstract>Peer Reviewed</dcterms:abstract>
   <dcterms:abstract>Postprint (published version)</dcterms:abstract>
   <dcterms:issued>2006-03</dcterms:issued>
   <dc:type>Article</dc:type>
   <dc:relation>https://ieeexplore.ieee.org/document/1603688</dc:relation>
   <dc:rights>Restricted access - publisher's policy</dc:rights>
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