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                  <mods:namePart>Cabellos Aparicio, Alberto</mods:namePart>
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                  <mods:dateIssued encoding="iso8601">2020-05-01</mods:dateIssued>
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               <mods:abstract>© 2020 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes,creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.The authors gratefully acknowledge support from the Spanish MINECO under grant PCIN-2015-012, from the EU’s H2020 FET-OPEN program under grants No. 736876 and No. 863337, and by the Catalan Institution for Research and Advanced Studies (ICREA).Peer ReviewedPostprint (author's final draft)</mods:abstract>
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                  <mods:topic>Àrees temàtiques de la UPC::Enginyeria electrònica::Microelectrònica::Circuits integrats</mods:topic>
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                  <mods:topic>Integrated circuits</mods:topic>
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                  <mods:topic>Microprocessors</mods:topic>
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                  <mods:topic>Dispersive channels</mods:topic>
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                  <mods:topic>Millimeter wave propagation</mods:topic>
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                  <mods:topic>Multipath interference</mods:topic>
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                  <mods:topic>Multiprocessor interconnection</mods:topic>
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                  <mods:topic>Transceivers</mods:topic>
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                  <mods:topic>Circuits integrats</mods:topic>
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