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00925njm 22002777a 4500 dc Timoneda, Xavier author Abadal Cavallé, Sergi author Franques, Antonio author Manessis, Dionyssios author Zhou, Jin author Torrellas, Josep author Alarcón Cot, Eduardo José author Cabellos Aparicio, Alberto author 2020-05-01 © 2020 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes,creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works. The authors gratefully acknowledge support from the Spanish MINECO under grant PCIN-2015-012, from the EU’s H2020 FET-OPEN program under grants No. 736876 and No. 863337, and by the Catalan Institution for Research and Advanced Studies (ICREA). Peer Reviewed Postprint (author's final draft) Àrees temàtiques de la UPC::Enginyeria electrònica::Microelectrònica::Circuits integrats Integrated circuits Microprocessors Dispersive channels Millimeter wave propagation Multipath interference Multiprocessor interconnection Transceivers Circuits integrats Microprocessadors Engineer the channel and adapt to it: enabling wireless intra-chip communication