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oai:recercat.cat:2117/224102025-07-17T09:09:31Zcom_2072_1033col_2072_452950

Microstructure influencing physical and mechanical properties of electrolytic tough pitch copper produced by equal channel angular pressing Higuera Cobos, Oscar Fabián Cabrera Marrero, José M. Universitat Politècnica de Catalunya. Departament de Ciència dels Materials i Enginyeria Metal·lúrgica Universitat Politècnica de Catalunya. PROCOMAME - Processos de Conformació de Materials Metàl·lics Àrees temàtiques de la UPC::Enginyeria dels materials::Metal·lúrgia Copper ECAP ETP copper SPD EBSD Electrical conductivity Mechanical properties Coure Samples of electrolytic tough pitch (ETP) copper were subjected to equal-channel angular pressing (ECAP) for up to 16 passes at room temperature following route Bc. The microstructural evolution was followed by Oriented Image Microscopy (OIM) and Differential Scanning Calorimetry (DSC) was used to estimate the activation energy and the recrystallization temperature after each ECAP pass. Also, mechanical properties after each pass were evaluated by tensile tests. Finally, electrical properties were analyzed. Results show that the stored energy increases on increasing ECAP deformation, while the recrystallization temperature decreases signi¿cantly. From a mechanical point of view a stable state is attained after 4 passes. Similarly, electrical conductivity slightly decreases down to a saturation state. Postprint (published version) 2013-11 Article Higuera, O.; Cabrera, J. Microstructure influencing physical and mechanical properties of electrolytic tough pitch copper produced by equal channel angular pressing. "Mechanics of materials", Novembre 2013, vol. 67, p. 9-14. 0167-6636 https://hdl.handle.net/2117/22410 eng Restricted access - publisher's policy 6 p. application/pdf