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A novel data acquisition system for obtaining thermal parameters of building envelopes Mobaraki, Behnam Komarizadehasl, Seyedmilad Castilla Pascual, Francisco Javier Lozano Galant, José Antonio Porras Soriano, Rocio Calor Monitorització tèrmica d'edificis Mètode basat en la temperatura Eficiència energètica Paràmetre de transmitància Sensors de baix cost Calor Monitorización térmica de edificios Método basado en la temperatura Eficiencia energética Parámetro de transmitancia Sensores de bajo coste HEAT Building thermal monitoring; Temperature-based method Energy efficiency Transmittance parameter Low-cost sensors Owing to the high energy consumption in the building sector, appraising the thermal performance of building envelopes is an increasing concern. Recently, a few in situ methodologies to diagnose the thermal parameters of buildings have been considered. However, because of their limitations such as low accuracy, limited number of measurements, and the high cost of monitoring devices, researchers are seeking a new alternative. In this study, a novel hyper-efficient Arduino transmittance-meter was introduced to overcome these limitations and determine the thermal parameters of building envelopes. Unlike conventional methodologies, the proposed transmittance-meter is based on synchronized measurements of different parameters necessary to estimate the transmittance parameter. To verify the applicability of the transmittance-meter, an experimental study was conducted wherein a temperature-controlled box model was thermally monitored, and the outputs of the transmittance-meter employed were compared with those captured by a commercial device. The results revealed a high level of reduction in cost and a low range of difference compared with the latter, thereby validating the applicability of the proposed thermal monitoring system. 2025-07-04T23:57:40Z 2025-07-04T23:57:40Z 2025-07-04T23:57:40Z 2022 info:eu-repo/semantics/article Mobaraki, Behnam; Komarizadehasl, Seyedmilad; Castilla Pascual, Francisco Javier [et al.]. A novel data acquisition system for obtaining thermal parameters of building envelopes. Buildings , 2022, 12(5), 670. Disponible en: <https://www.mdpi.com/2075-5309/12/5/670>. Fecha de acceso: 30 jun. 2025. DOI: 10.3390/buildings12050670 2075-5309 http://hdl.handle.net/20.500.12328/4921 https://dx.doi.org/10.3390/buildings12050670 eng Buildings 12;5 https://creativecommons.org/licenses/by/4.0/ info:eu-repo/semantics/openAccess © 2022 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). MDPI