Recommended citation for this document

Leseduarte Cuevas, Sergio ; Marco Colás, Santiago ; Beyne, Eric ; Van Hoof, Rita ; Marty, Antoine ; Pinel, Stèphane ; Vendier, Olivier ; Coello-Vera, Augustín. "Residual thermomechanical stresses in thinned-chip assemblies". Universitat de Barcelona. 2010. <http://hdl.handle.net/2445/8692>. [Consulta: 29-08-14].