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dc.contributor | Universitat de Barcelona |
---|---|
dc.contributor.author | Carmona Flores, Manuel |
dc.contributor.author | Marco Colás, Santiago |
dc.contributor.author | Palacín Roca, Jordi |
dc.contributor.author | Samitier i Martí, Josep |
dc.date | 2009-06-17T09:05:06Z |
dc.date | 2009-06-17T09:05:06Z |
dc.date | 1999 |
dc.identifier.citation | 1521-3331 |
dc.identifier.citation | 146376 |
dc.identifier.uri | http://hdl.handle.net/2445/8690 |
dc.format | 7 p. |
dc.format | application/pdf |
dc.language.iso | eng |
dc.publisher | IEEE |
dc.relation | Reproducció del document publicat a http://dx.doi.org/10.1109/6144.774738 |
dc.relation | IEEE Transactions on Components Packaging and Manufacturing Technology Part A, 1999, vol. 22, núm. 2, p. 238-244 . |
dc.relation | http://dx.doi.org/10.1109/6144.774738 |
dc.relation | http://dx.doi.org/10.1109/6144.774738 |
dc.rights | (c) IEEE, 1999 |
dc.rights | info:eu-repo/semantics/openAccess |
dc.subject | Circuits integrats |
dc.subject | Convolucions (Matemàtica) |
dc.subject | Mètodes iteratius (Matemàtica) |
dc.subject | Convolution |
dc.subject | Finite element analysis |
dc.subject | Integrated circuit packaging |
dc.subject | Iterative methods |
dc.subject | Multichip modules |
dc.subject | Thermal model |
dc.subject | Thermal resistance |
dc.subject | Time-domain analysis |
dc.title | A time-domain method for the analysis of thermal impedance response preserving the convolution form |
dc.type | info:eu-repo/semantics/article |
dc.type | info:eu-repo/semantics/publishedVersion |
dc.description.abstract |