Para acceder a los documentos con el texto completo, por favor, siga el siguiente enlace: http://hdl.handle.net/2445/9522
dc.contributor | Universitat de Barcelona |
---|---|
dc.contributor.author | Costa, J. M. |
dc.contributor.author | Sagués i Mestre, Francesc |
dc.contributor.author | Vilarrasa, M. |
dc.date | 2009-10-06T08:31:46Z |
dc.date | 2009-10-06T08:31:46Z |
dc.date | 1991 |
dc.identifier.citation | 1050-2947 |
dc.identifier.citation | 54928 |
dc.identifier.uri | http://hdl.handle.net/2445/9522 |
dc.format | 4 p. |
dc.format | application/pdf |
dc.language.iso | eng |
dc.publisher | The American Physical Society |
dc.relation | Reproducció digital del document publicat en format paper, proporcionada per PROLA i http://dx.doi.org/10.1103/PhysRevA.43.7057 |
dc.relation | Physical Review A, 1991, vol. 43, núm. 12, p. 7057-7060. |
dc.relation | http://dx.doi.org/10.1103/PhysRevA.43.7057 |
dc.rights | (c) The American Physical Society, 1991 |
dc.rights | info:eu-repo/semantics/openAccess |
dc.subject | Electroquímica |
dc.subject | Deposició (Metal·lúrgia) |
dc.subject | Electrochemistry |
dc.subject | Plating |
dc.title | Growth rate of fractal copper electrodeposits: Potential and concentration effects |
dc.type | info:eu-repo/semantics/article |
dc.type | info:eu-repo/semantics/publishedVersion |
dc.description.abstract |