Para acceder a los documentos con el texto completo, por favor, siga el siguiente enlace: http://hdl.handle.net/2099.1/22202

Proposal of field replacement process improvement of the new lithography machine in the semiconductor industry
Tortras Raventos, Alejandro
Universitat Politècnica de Catalunya. Departament d'Organització d'Empreses; Coves Moreno, Anna Maria
The developments in lithography of ASML have increased the complexity of their machines and the replacement of some parts has become a very hard task for engineers. The different processes within engineering, logistics and the local office at the customer factory are not lean and can be optimized. Following the 8D problem solving methodology used by ASML, we deduced that the software tool that is supporting the replacement process is obsolete. Coach, which is the current software tool, is about 20 years old, and cannot support the need of a new way of working brought by the increased complexity of the machine. The main goal of the project is to provide efficient software tools to ASML engineers so that they can prepare and execute replacements of new machines’ critical parts, the fastest, the easiest and the most cost effective way possible. Three alternatives to solve these problems are ranked using a Multi-Criteria Analysis method. These alternatives are: Incorporate ARE (Automatic Recovery Engine) to replacements, adapt a module called SAP-ME from Manufacturing Engineering department and, last, to implement an external software called Cortona 3D that uses CAD designs to create Work Instructions for the procedures. The result is that adapting SAP-ME is the best alternative, and with that the goal initially set, has been properly achieved. The collaboration of experts in the field of this project was essential to reach them. It is a profitable solution in 4 years long and its implementation will give high benefits such as time saving as well as benefits to the customers by increasing the up-time of the machine. Sensibility analysis proves that it is a robust solution, but it is not feasible at the moment due to problems of property rights of having connectivity to ASML network at the customer factory.
Àrees temàtiques de la UPC::Enginyeria mecànica::Fabricació::Disseny i càlcul de màquines
Lithography -- Machinery
Industrial equipment
Machine design
Semiconductors industry
Litografia -- Maquinària
Maquinària en la indústria
Maquinaria -- Disseny
Semiconductors -- Indústria i comerç
info:eu-repo/semantics/bachelorThesis
Universitat Politècnica de Catalunya
         

Mostrar el registro completo del ítem