Temperature sensors to measure the central frequency and 3 dB bandwidth in mm W power amplifiers

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To access the full text documents, please follow this link: http://hdl.handle.net/2117/23083

dc.contributor	Universitat Politècnica de Catalunya. Departament d'Enginyeria Electrònica
dc.contributor	Universitat Politècnica de Catalunya. HIPICS - Grup de Circuits i Sistemes Integrats d'Altes Prestacions
dc.contributor.author	Altet Sanahujes, Josep
dc.contributor.author	Mateo Peña, Diego
dc.contributor.author	Gómez Salinas, Dídac
dc.contributor.author	González Jiménez, José Luis
dc.contributor.author	Martineau, B.
dc.contributor.author	Siligaris, Alexandre
dc.contributor.author	Aragonès Cervera, Xavier
dc.date	2014-04
dc.identifier.citation	Altet, J. [et al.]. Temperature sensors to measure the central frequency and 3 dB bandwidth in mm W power amplifiers. "IEEE microwave and wireless components letters", Abril 2014, vol. 24, núm. 4, p. 272-274.
dc.identifier.citation	1531-1309
dc.identifier.citation	10.1109/LMWC.2013.2293668
dc.identifier.uri	http://hdl.handle.net/2117/23083
dc.language.iso	eng
dc.relation	http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6701395
dc.rights	Attribution-NonCommercial-NoDerivs 3.0 Spain
dc.rights	info:eu-repo/semantics/openAccess
dc.rights	http://creativecommons.org/licenses/by-nc-nd/3.0/es/
dc.subject	Àrees temàtiques de la UPC::Enginyeria electrònica::Instrumentació i mesura::Sensors i actuadors
dc.subject	Temperature measurements
dc.subject	Built-in test
dc.subject	CMOS millimeter wave integrated circuits
dc.subject	design for testability
dc.subject	frequency response
dc.subject	temperature measurement
dc.subject	Termometria
dc.title	Temperature sensors to measure the central frequency and 3 dB bandwidth in mm W power amplifiers
dc.type	info:eu-repo/semantics/publishedVersion
dc.type	info:eu-repo/semantics/article
dc.description.abstract	This letter introduces a novel on-chip measurement technique for the determination of the central frequency and 3 dB bandwidth of a 60 GHz power amplifier (PA) by performing low frequency temperature measurements. The temperature sensor is embedded in the same silicon die as the PA, and placed in empty spaces next to it. Results confirm that temperature sensors can be used as functional built-in testers which serve to reduce testing costs and enhance yield as part of self-healing strategies.
dc.description.abstract	Peer Reviewed

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