From curing kinetics to network structure: A novel approach to the modeling of the network buildup of epoxy-anhydride thermosets

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dc.contributor	Universitat Politècnica de Catalunya. Departament de Màquines i Motors Tèrmics
dc.contributor	Universitat Politècnica de Catalunya. TERFIQ - Grup de Termodinàmica i Fisico-Química
dc.contributor.author	Fernández Francos, Xavier
dc.contributor.author	Ramis Juan, Xavier
dc.contributor.author	Serra Albet, Àngels
dc.date	2014-01-01
dc.identifier.citation	Fernández, X.; Ramis, X.; Serra, À. From curing kinetics to network structure: A novel approach to the modeling of the network buildup of epoxy-anhydride thermosets. "Journal of polymer science. Part A, polymer chemistry", 01 Gener 2014, vol. 52, núm. 1, p. 61-75.
dc.identifier.citation	0887-624X
dc.identifier.citation	10.1002/pola.26972
dc.identifier.uri	http://hdl.handle.net/2117/21428
dc.language.iso	eng
dc.rights	Attribution-NonCommercial-NoDerivs 3.0 Spain
dc.rights	info:eu-repo/semantics/openAccess
dc.rights	http://creativecommons.org/licenses/by-nc-nd/3.0/es/
dc.subject	Àrees temàtiques de la UPC::Enginyeria dels materials::Materials plàstics i polímers
dc.subject	Àrees temàtiques de la UPC::Física::Termodinàmica
dc.subject	Chemical kinetics
dc.subject	Heat resistant plastics
dc.subject	Differential scanning calorimetry (DSC)
dc.subject	Epoxy-anhydride curing
dc.subject	Gelation
dc.subject	kinetics (polym.)
dc.subject	Network buildup
dc.subject	Networks
dc.subject	Ring-opening polymerization
dc.subject	Structure
dc.subject	Thermosets
dc.subject	Cinètica química
dc.subject	Plàstics termostables
dc.title	From curing kinetics to network structure: A novel approach to the modeling of the network buildup of epoxy-anhydride thermosets
dc.type	info:eu-repo/semantics/publishedVersion
dc.type	info:eu-repo/semantics/article
dc.description.abstract	The curing kinetics and network buildup during curing of epoxy–anhydride formulations using tertiary amines as initiators are reviewed in this work. A mechanism-based kinetic and structural model has been defined, showing better prediction capabilities than previous living polymerization and simple regeneration models. The curing kinetics have been analyzed using differential scanning calorimetry (DSC), and the gelation during curing has been determined by combined thermomechanical analysis and DSC. The effect of initiator content and epoxy equivalent weight are taken into account. The network buildup has been modeled using a stochastic network buildup model based on the random combination of primary chains generated by the kinetic model.

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