Recent studies have shown that the aging of integrated circuits may modify electromagnetic emission significantly. This paper reports on an experiment to elucidate the origins of emis- sion level changes in a test chip using 90-nm CMOS technology. Circuit analysis, combined with electromagnetic emission and on- chip power supply voltage bounce measurements made during the application of electric stress, have identified the role of intrinsic wear-out mechanisms, which contribute to a progressive change in the transient current produced by the circuit.

Peer Reviewed