Fabrication and experimental demonstration of a four-channel × 40 Gb/s TriPleX all-optical wavelength conversion platform

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dc.contributor	Universitat Politècnica de Catalunya. Departament de Teoria del Senyal i Comunicacions
dc.contributor.author	Avramopoulos, Hércules
dc.contributor.author	Klein, E.J.
dc.contributor.author	Stamatiadis, C.
dc.contributor.author	Vyrsokinos, K.
dc.contributor.author	Stampoulidis, L.
dc.contributor.author	Lazarou, I.
dc.contributor.author	Schrenk, Bernhard
dc.contributor.author	Leinse, A.
dc.contributor.author	Heideman, R.
dc.contributor.author	Bruinink, C.
dc.date	2011
dc.identifier.citation	Stamatiadis, C. [et al.]. Fabrication and experimental demonstration of a four-channel × 40 Gb/s TriPleX all-optical wavelength conversion platform. "Journal of lightwave technology", 2011, vol. 29, núm. 12, p. 1886-1891.
dc.identifier.citation	0733-8724
dc.identifier.citation	10.1109/JLT.2011.2148692
dc.identifier.uri	http://hdl.handle.net/2117/13373
dc.language.iso	eng
dc.relation	http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=5754563
dc.relation	info:eu-repo/grantAgreement/EC/FP7/224375/EU/Terabit-on-chip:micro and nano-scale silicon photonic integrated components and sub-systems enabling Tb%2Fs-capacity, scalable and fully integrated photonic routers/BOOM
dc.rights	info:eu-repo/semantics/openAccess
dc.subject	Optical device fabrication
dc.subject	Optical filtres
dc.subject	Optical waveguides
dc.subject	Optical wavelength conversion
dc.subject	Semiconductor optical amplifiers
dc.subject	Fotònica
dc.subject	Amplificadors òptics semiconductors
dc.title	Fabrication and experimental demonstration of a four-channel × 40 Gb/s TriPleX all-optical wavelength conversion platform
dc.type	info:eu-repo/semantics/publishedVersion
dc.type	info:eu-repo/semantics/article
dc.description.abstract	We present a scalable circuit that performs multichannel, all-optical wavelength conversion employing semiconductor optical amplifiers (SOAs) and a densely integrated TriPleX photonic chip. The TriPleX device performs chirp filtering and signal polarity inversion with on-chip signal processing. The chip includes a total number of 40 arrays of Si3 N4–SiO2 microring resonators, delay interferometers and heating elements. The total footprint of each array is 2.19mm2 and the power consumption per integrated heater is below 80 mW. We have interconnected the TriPleX chip with SOAs and we demonstrate experimentally 4x40 Gb/s, parallel and wavelength tunable wavelength conversion with power penalties of less than 3 dB.
dc.description.abstract	Peer Reviewed

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