Temperature as observable magnitude in silicon integrated circuits to characterize high frequency analog circuits

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Title:	Temperature as observable magnitude in silicon integrated circuits to characterize high frequency analog circuits
Author:	Mateo Peña, Diego; Altet Sanahujes, Josep; Gómez Salinas, Dídac; Aragonès Cervera, Xavier
Other authors:	Universitat Politècnica de Catalunya. Departament d'Enginyeria Electrònica; Universitat Politècnica de Catalunya. HIPICS - Grup de Circuits i Sistemes Integrats d'Altes Prestacions
Abstract:	This paper introduces a novel on-chip measurement technique for the determination of the central frequency and 3dB bandwidth of a 60GHz power amplifier (PA) by performing low frequency temperature measurements in silicon integrated circuits. The techniques is implemented by using a temperature sensor embedded in the same silicon die as the PA, and placed in empty spaces next to it. Results confirm that temperature sensors can be used as functional built-in testers which serve to reduce testing costs and enhance yield as part of self-healing strategies.
Abstract:	Peer Reviewed
Subject(s):	-Àrees temàtiques de la UPC::Enginyeria electrònica::Microelectrònica::Circuits integrats -Materials -- Congresses -Integrated circuits -Silicon temperature measurement -CMOS millimeter wave integrated circuits -Design for Testability -Materials -- Congressos -Circuits integrats
Rights:	Attribution-NonCommercial-NoDerivs 3.0 Spain http://creativecommons.org/licenses/by-nc-nd/3.0/es/
Document type:	Article - Published version Conference Object
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