Comparison of air gap breakdown and substrate injection as mechanisms to induce dielectric charching in microelectromechanical switches

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Title:	Comparison of air gap breakdown and substrate injection as mechanisms to induce dielectric charching in microelectromechanical switches
Author:	Molinero Giles, David; Castañer Muñoz, Luis María
Other authors:	Universitat Politècnica de Catalunya. Departament d'Enginyeria Electrònica; Universitat Politècnica de Catalunya. MNT - Grup de Recerca en Micro i Nanotecnologies
Abstract:	Experiments show that air breakdown and substrate carrier conduction can be responsible of the dielectric charging of microelectromechanical devices after electrical stress. Test conducted under vacuum allows us to isolate the two mechanisms. It is also shown that the relative importance of the two mechanisms depends on the dielectric nature and technology.
Abstract:	Peer Reviewed
Subject(s):	-Àrees temàtiques de la UPC::Enginyeria electrònica::Microelectrònica -Microelectromechanical systems. -Breakdown (Electricity) -Air gap breakdown -Dielectric charging -Dielectric layer -Dielectric thin films -Electric breakdown -Electrical stress -Microelectromechanical switches -Reliability -Substrate carrier conduction -Substrate injection -MEMS -Sistemes microelectromecànics
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Document type:	Article
Published by:	American Institute of Physics
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